GOOD NEWS!Another major breakthrough in “Chinese-made chips”!

The research team of Fudan University has released a latest scientific and technological achievement, inventing a new type of functional photoresist that can integrate 27 million devices on a full-frame chip, and is actively seeking to transform the results. On the day the news landed, the photoresist concept sector on the stock market moved immediately, and the leading stocks rose by 9%.
The chips generally referred to by the outside world are silicon-based chips, and the density of transistors on one square millimeter has exceeded 200 million! China's achievements this time are in another chip field, integrating chips for organic semiconductor materials. Compared with the former, the advantages of organic semiconductors are intrinsic flexibility, good biocompatibility and low cost. They are widely used in emerging fields such as wearable electronic devices and bioelectronic devices. Judging from the current hot momentum of the artificial intelligence market, organic chips must have great potential in the future.
In terms of integration, the industry divides chip integration into small scale, medium scale, large scale, ultra-large scale and extra-large scale! The integration of organic chips can usually only reach the ultra-large scale integration level; however, this new photoresist developed by the Chinese research team can achieve stable manufacturing of sub-micron feature size patterns, bringing the integration of organic chips to the ultra-large-scale integrated circuit technology level in one fell swoop! More importantly, in traditional chip processes, photoresists are only used as processing templates, while the pattern of this new photoresist itself is a semiconductor that can conduct electricity and sensing, greatly reducing manufacturing costs.